ASME Santa Clara Valley Section: Who Killed the PCB?

Description

The development of modern printed circuit boards can be challenging due to the need to overcome coupled electrical, thermal, and mechanical reliability concerns. Printed circuit boards are needed in almost all electronic products across all industries, and accurate modeling and simulation are key to ensuring that these products operate reliably. In this presentation, we will discuss multiple issues that electrical and mechanical engineers must address during printed circuit board design and how advanced physics-based simulation tools can be used to optimize performance, prevent potential failures, and predict reliability. Design topics will include signal and power integrity, electrothermal stress, mechanical shock and vibration, and solder joint reliability. We will discuss how this collaborative workflow enables engineers to efficiently improve electrical, thermal, and mechanical characteristics of printed circuit board designs. Presented by Mark Jones and MingYao Ding at Ozen Engineering.